Honorary General Chair
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Ed_Tiedemann_resize.jpg?itok=om3oGxK8)
Ed Tiedemann
Qualcomm Technologies Inc, USA
General Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Riccardo-Trivisonno.jpg?itok=opXx6OZd)
Riccardo Trivisonno
Huawei, Germany
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/peris.png?itok=3Y-5ZgiQ)
Periklis Chatzimisios
International Hellenic University, Greece and University of New Mexico, USA
TPC Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Petar%20Popovski.png?itok=cFK_GlzP)
Petar Popovski (Lead)
Aalborg University, Denmark
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Narcis%20Cardona_386.jpg?itok=wvo9Ib4D)
Narcis Cardona
UPV, Spain
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Aggeliki_Sgora.jpg?itok=lpypc0eW)
Aggeliki Sgora
Ionian University, Greece
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Konstantinos_Samdanis386.png?itok=fffmA5zM)
Konstantinos Samdanis
Lenovo, Germany