Track on Emerging Wireless Communications towards 6G Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/romano.jpg?itok=sFHq4Tea)
Giovanni Romano
3GPP Expert at Novamint, Italy
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/mate_boban_386.jpg?itok=lsKi0T-c)
Mate Boban
Huawei, Germany
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/tuncerbaykas_386.jpg?itok=FLp4Eewn)
Tuncer Baykas
Kadir Has University, Turkey
Track on IoT, URLLC and Automotive Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Johannes.jpg?itok=YBSpRXSK)
Johannes Springer
Deutsche Telekom AG / T-Systems International GmbH
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Fabrice.jpg?itok=DAMZCPdG)
Fabrice Theoleyre
CNRS, France
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Athul_Prasad.jpg?itok=nD2msLKn)
Athul Prasad
Samsung, USA
Track on Softwarization, Slicing, Automation and Network Management Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Walter%20Cerroni.png?itok=CPkFBBaG)
Walter Cerroni
University of Bologna, Italy
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Bulakci_386.jpg?itok=ctwsNWWY)
Ömer Bulakci
Nokia, Germany
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Antonio-de-la-De-Olivera-scaled_0.jpg?itok=doCgvDMZ)
Antonio de la Oliva
University Carlos III of Madrid, Spain
Track on Verticals, Services and Applications Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Riccardo%20Guerzoni_386.jpg?itok=HC3ZasTV)
Riccardo Guerzoni
Docomo, Germany
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/toktam_386.jpg?itok=ulINIW-4)
Toktam Mamhoodi
King’s College London, UK
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Kamesh2019_0.jpg?itok=asdGe8la)
Kamesh Namuduri
University of North Texas, USA
Track on Access Network, Edge Computing and Transport Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Diego%20R.%20Lopez_386.jpg?itok=1QSXlL62)
Diego Lopez
Telefonica, Spain
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Dr%20Chih-Lin%20386.jpg?itok=YLCtxAZa)
Chih Lin
China Mobile, China
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Anwer_exfo.jpg?itok=2tzNc7HF)
Anwer Al-Dulaimi
EXFO, Canada
Keynotes Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Dario.jpg?itok=AibroWSu)
Dario Sabella
Intel, Germany
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Jim_Lansford.2.sm_.jpg?itok=L99kiFl2)
Jim Lansford
FaraFir Consulting, Romania
Panel Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Anastasios%20Gavras.jpg?itok=1jI7yET_)
Anastasius Gavras
Eurescom, Germany
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Mona%20Ghassemian%20.jpg?itok=upUVRktY)
Mona Ghassemian
Huawei, UK
Tutorial Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Daniel%20Corujo386.png?itok=O6ePrIo0)
Daniel Corujo
ITAV, Portugal
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/JaeSeung_-Song.png?itok=EKrpfaTL)
JaeSeung Song
Sejong University, South Korea
Special Session Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Manos%20Pateromichelakis.jpg?itok=zJkSuWQh)
Emmanouil Pateromikelakis
Lenovo, Germany
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Adrian%20Kliks.jpg?itok=sm_5VY0x)
Adrian Kliks
Poznan University of Technology, Poland
Standards Training Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/David386.jpg?itok=5RNcHJ-Q)
David Boswarthick
ETSI, France
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/irvine.jpg?itok=wKh18CMC)
James Irvine
Strathclyde University, Scotland
Demos/Posters Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/MichaelRuder.jpg?itok=K0ThiaNn)
Michael Ruder
Qualcomm Technologies Inc, USA
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/EvgenyKhorov%20.png?itok=Itize02M)
Evgeny Khorov
Institute for Information Transmission Problems, Russia
Publication Chair
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/dkallergis386.png?itok=1DTrx3Oj)
Dimitrios Kallergis
University of West Attica, Greece
Publicity Chair
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Mohab%20Mangoud.jpg?itok=o3b1uHMe)
Mohab Mangoud
University of Bahrain, Bahrain
Young Professionals Chair
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/VirginiaPilloni386.png?itok=nnU4ZRKo)
Virginia Pollini
University of Cagliari, Italy
Liaisons to WGs and/or Standards Communities Co-Chairs
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Xueli%20An.jpg?itok=B9_zg5af)
Xueli An
one6G/Huawei, Germany
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Mueck%20Markus.jpg?itok=LV2ur7VE)
Markus Mueck
ETSI/Intel, Germany
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/David%20Mazzarese.jpg?itok=3uKy5UX7)
David Mazzarese
3GPP/ Huawei, France
![](https://cscn2023.ieee-cscn.org/sites/cscn2023.ieee-cscn.org/files/styles/committee_member/public/Ruiqi%20Liu.jpg?itok=hgD2-o_x)
Ruiqi (Richie) Liu
ITU/ZTE Corporation, China